Chapter 1012: Kidnapping

“The future of silicon-based semiconductors is predictable, but our previous investment cannot be shelved, so we have not stopped pursuing further reductions in failure rates while maintaining device characteristics.

As a technology supplier, we are always looking for ways to achieve higher performance through new equipment, and we are also adjusting the manufacturing process in the fab.

In the fab, we use many innovative process steps for planar gate and trench gate power. Innovation also means many errors and compatibility difficulties. Sometimes a difference in a technical point will cause the entire wafer to be scrapped.

For example, thicker and lighter doped stacks support higher breakdown voltages, but increased on-resistance.

So in order to form trenches on the device, some In this case, the trench size is reduced to 1μm (micrometer) or even smaller.

To form the trench, we must deposit another mask layer on the device and inject dopants into it.

The trench is patterned and then etched. Since the trench is filled with gate material, the source and drain are finally formed.

Each of these steps is extremely important. We need to thank the technical support provided by our official etching research institute of Daxia, which allows us to use the world's top etching technology. "

From wafers to wafer cutting, etching, photolithography and chip making, to the back, Gu Qing even explained to the senior executives of these technology companies the solution direction and specific solutions of his own Jiuzhou Technology Company for some semiconductor chip problems.

"The so-called 3D stereo chips in the West are actually the same as our previous stacked chips. It is like stacking chips layer by layer like building a house, from a set of bungalows to a multi-story residential building.

What a chip can do is limited, and its performance is fixed. If multiple chips are installed in a flat surface, although the overall processor performance can be improved, it will cause the chip template area of ​​the processor core to be too large, and there will be too many wire end interfaces, which is easy to cause failures.

The 3D stereo chips and our stacked chips can stack the chips one by one, and achieve more powerful performance in the same area.

However, this technology will make the chip heat dissipation problem extremely difficult to solve. Once the chip has a problem, the processor must be replaced, and there is no possibility for consumers to replace a single chip.

In addition, the processor with a 3D stacking structure also puts a great test on the stability of semiconductor chips. During installation and use, a bump and shake may cause chip failure.

The chip technology developed by that group of Western technology companies has been studied by our company's semiconductor engineers. The silicon-based semiconductor technology we cooperated with this time is fully capable of stacking chip technology, and can basically make chips that are at least three times ahead of Western technology companies.

If the partners want to further participate, they can also contact and communicate with other upstream and downstream technology companies that use our technology to develop structures and designs by themselves. Although there will not be very powerful chips in the short term, as long as the rules and methods are mastered, it is entirely possible to replace the structure once every three years, or even upgrade the structure once every two years.

But I still hope that the partners can be good students first, study hard, and then have enough foundation and experience, and then carry out research and development and design by themselves. Moreover, the chip design project also requires a strong enough team of engineers to complete.

At present, domestic and foreign companies, research institutions and even official organizations have a strong desire for students, mentors and working staff in this industry.

Friends who have ideas about this project should contact domestic universities to communicate clearly. After all, our technology cannot be transmitted abroad without passing the application review and approval. Even if it is to go to the overseas branches of domestic companies, the personnel who master our technology need to apply for it every time. "

To be honest, Gu Qing spoke very seriously, and it can even be said that he did not hide anything in many projects. He not only clearly explained the advantages and disadvantages of the technology, but also made the project's particularity public.

When the senior executives of the technology companies heard the last part, the mountains and rivers between their eyebrows were no longer ugly, but extremely twisted and weird.

We all know that Jiuzhou Technology has close cooperation with the government, but how did you Jiuzhou Technology come up with so many technical sensitive points and prohibited projects? Even let the government set up a special department to manage them?

Which of the companies present, Xia Wei, BYD, and CATL, did not cooperate with the government? Which one is not a well-known existence in the industry?

But the cooperation is so close that some core systems are even uploaded to the official platform. Just do it, and there is no technical support and technical protection treatment like Jiuzhou Technology!

Yu Chengdong took a deep breath, pinched his nose with his right hand, and narrowed his eyes.

The Kirin chip of its own used a structure optimized and developed based on the ARM architecture before, and later learned the chip structure of Jiuzhou Technology, but so far, Xia Wei has not "learned to be a master".

Only by entering the world of Jiuzhou semiconductors can you understand how terrible Jiuzhou Technology is.

This young man actually supports the semiconductor department to directly develop chips from the bottom up. Not only did he abandon the MIPS instruction set, he also developed his own instruction set architecture, self-developed AI processors, self-developed program software, and even designed and developed industrial software platforms and intelligent AI assistance in the production process.

It's already so scary, Jiuzhou Technology also has the most powerful robotic arms and process manufacturing dust-free workshops in the industry!

These technologies are not only extremely important for the semiconductor chip industry, but also for the production and development of other high-tech products.

And those semiconductor switch components...

In the ocean of hundreds of millions of transistors, small switches are accurately made.

Even if the internal architecture of the chips of Jiuzhou Technology introduced by Gu Qing is not much different from the 3D chips made by Western technology companies, they all improve computing performance by changing the arrangement and structure of countless transistors inside the chip and building a sufficiently powerful performance architecture.

But the data comparison of sorting and structure, optimizing computing and energy consumption is too powerful, right?

If we follow the data given by Gu Qing, as long as we use the technology of Jiuzhou Semiconductor and carefully develop chips, we can develop chips that are twice as powerful as the latest chips in Pingguo in two years at most!

At that time, we can move the chips developed by ourselves to the 3D structure, which will be a terrible performance improvement!

At this moment, Yu Chengdong really has the urge to kidnap Gu Qing.